The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Nov. 27, 2018
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Keijiro Kojima, Nagaokakyo, JP;
Yuya Ishida, Nagaokakyo, JP;
Hiroyuki Sugie, Nagaokakyo, JP;
Katsuyuki Takahashi, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 1/28 (2006.01); H01F 5/04 (2006.01); H01F 17/04 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 1/28 (2013.01); H01F 5/04 (2013.01); H01F 17/045 (2013.01); H01F 27/24 (2013.01); H01F 27/2823 (2013.01); H01F 27/2828 (2013.01); H01F 27/292 (2013.01);
Abstract
A wire-wound coil component is an electronic component including a core main body, such as a molded body, containing a magnetic powder resin in which a resin serves as a binder, and an oxide film covering at least a portion of the surface, such as the lower surface, of the core main body. The electronic component further includes an external electrode including a base layer formed on the surface of the oxide film. The base layer is a metal layer having high affinity for oxygen.