The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Nov. 26, 2020
Beijing Vacuum Electonics Research Institute, Beijing, CN;
Xinghui Li, Beijing, CN;
Ting Du, Beijing, CN;
Haijun Chen, Beijing, CN;
Zhongzheng Liu, Beijing, CN;
Shunlu Xiao, Beijing, CN;
BEIJING VACUUM ELECTONICS RESEARCH INSTITUTE, Beijing, CN;
Abstract
Disclosed are a mold assembly for making alkali metal wax packets, a method for preparing same, and a method for using same. The mold assembly comprises a silicon substrate (), the silicon substrate () comprising a mold isolator () at the edge of the silicon substrate () and a silicon substrate central portion (). The upper surface of the silicon substrate central portion () is indented to form a plurality of wax packet receiving cavities (). A cavity isolator () locates between adjacent wax packet receiving cavities (). A release sacrificial layer () is formed on the upper surface of the silicon substrate (), and a paraffin layer () is formed on the upper surface of the release sacrificial layer () away from the silicon substrate (). Cavities () for containing alkali metal are formed on a side of the paraffin layer () away from the release sacrificial layer (). The mold isolator () is provided with corrosion release holes (). The mold assembly can reliably and controllably achieve batch production of uniform alkali metal wax packet arrays and is completely compatible with MEMS and microelectronic processes, with simple processes that can be easily implemented and high operability. The wax packet mold assembly can be reused, such that wasting of raw materials can be avoided, and the cost of batch production can be effectively reduced.