The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Aug. 26, 2021
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Miyuki Hosoba, Kanagawa, JP;

Junichiro Sakata, Kanagawa, JP;

Hideaki Kuwabara, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/1362 (2006.01); H01L 29/45 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); G02F 1/1339 (2006.01); G02F 1/1343 (2006.01); G02F 1/1345 (2006.01); G02F 1/136 (2006.01); G02F 1/1368 (2006.01); G02F 1/167 (2019.01); G09G 3/34 (2006.01); G09G 3/36 (2006.01); H10K 59/121 (2023.01);
U.S. Cl.
CPC ...
G02F 1/136227 (2013.01); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H01L 27/1255 (2013.01); H01L 27/1274 (2013.01); H01L 29/45 (2013.01); H01L 29/513 (2013.01); H01L 29/518 (2013.01); H01L 29/66742 (2013.01); H01L 29/66969 (2013.01); H01L 29/786 (2013.01); H01L 29/78606 (2013.01); H01L 29/78648 (2013.01); H01L 29/7869 (2013.01); H01L 29/78696 (2013.01); G02F 1/1339 (2013.01); G02F 1/134336 (2013.01); G02F 1/1345 (2013.01); G02F 1/13606 (2021.01); G02F 1/136286 (2013.01); G02F 1/1368 (2013.01); G02F 1/167 (2013.01); G02F 2201/123 (2013.01); G09G 3/344 (2013.01); G09G 3/3677 (2013.01); G09G 2300/0426 (2013.01); G09G 2310/0286 (2013.01); G09G 2310/08 (2013.01); H10K 59/1213 (2023.02);
Abstract

An object is to provide a semiconductor device having a structure in which parasitic capacitance between wirings can be efficiently reduced. In a bottom gate thin film transistor using an oxide semiconductor layer, an oxide insulating layer used as a channel protection layer is formed above and in contact with part of the oxide semiconductor layer overlapping with a gate electrode layer, and at the same time an oxide insulating layer covering a peripheral portion (including a side surface) of the stacked oxide semiconductor layer is formed. Further, a source electrode layer and a drain electrode layer are formed in a manner such that they do not overlap with the channel protection layer. Thus, a structure in which an insulating layer over the source electrode layer and the drain electrode layer is in contact with the oxide semiconductor layer is provided.


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