The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Feb. 21, 2022
Applicant:

Nextinput, Inc., Mountain View, CA (US);

Inventors:

Ali Foughi, Atherton, CA (US);

Ryan Diestelhorst, Atlanta, GA (US);

Dan Benjamin, Atlanta, GA (US);

Julius Minglin Tsai, San Jose, CA (US);

Michael Dueweke, Campbell, CA (US);

Assignee:

DecaWave, Ltd., Dublin, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/18 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01L 1/14 (2006.01); G01L 1/16 (2006.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); B81B 7/02 (2013.01); B81C 1/00246 (2013.01); G01L 1/14 (2013.01); G01L 1/16 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2201/013 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0714 (2013.01); B81C 2203/0728 (2013.01);
Abstract

In one embodiment, a ruggedized wafer level microelectromechanical ('MEMS') force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.


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