The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Mar. 12, 2021
Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Kei Anai, Ageo, JP;

Jung-Lae Jo, Ageo, JP;

Kengo Tashiro, Ageo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); H01L 24/27 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29293 (2013.01); H01L 2224/293 (2013.01);
Abstract

A temporary fixing composition is provided that is used to temporarily fix a first bonding target material and a second bonding target material to each other before the two bonding target materials are bonded to each other. The temporary fixing composition contains a first organic component having a viscosity of less than 70 mPa·s at 25° C. and a boiling point of 200° C. or lower and a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher. It is preferable that, when thermogravimetry-differential thermal analysis is performed under the conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, the 95% mass reduction temperature is lower than 300° C.


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