The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Dec. 26, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Toshiki Kitazawa, Tokyo, JP;
Homare Yamato, Tokyo, JP;
Masahiko Shimizu, Tokyo, JP;
Hiromichi Akiyama, Tokyo, JP;
Akihiro Terasaka, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
The preset invention is to mold a laminate at a high accuracy by appropriately generating slippage between fiber sheets of the laminate at bending. A method for molding a laminate includes a step in which a plurality of gripping parts, which are arranged apart from each other, grip an area, wherein slippage between fiber sheets is prevented, in a plate-shaped laminate including a plurality of fiber sheets laminated each other; a step in which the plurality of gripping parts grip the area wherein slippage between the fiber sheets is prevented, while maintaining the state wherein relative moving of the area of the laminate and the gripping parts is prevented; and a step in which the gripping parts move so as to subject the laminate to bending.