The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Apr. 26, 2021
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Beytullah Yasin Kilic, Karlstein, DE;

Leoni Wilhelm, Hanau, DE;

Jakob Fischer, Hanau, DE;

Jens Trötzschel, Hanau, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 17/30 (2006.01); A61N 1/375 (2006.01); H01R 13/52 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); H01B 17/303 (2013.01); H01R 13/5224 (2013.01); H01L 23/481 (2013.01); H01R 2201/12 (2013.01);
Abstract

One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.


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