The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Mar. 29, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventor:

Hongfei Cheng, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); H01L 27/02 (2006.01); H10K 59/12 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H01L 27/0296 (2013.01); H10K 59/1201 (2023.02);
Abstract

An array substrate and a fabrication method thereof, an array substrate motherboard, and a display device are disclosed. The array substrate includes a display region and a bonding region outside the display region. The array substrate further includes: a bonding electrode, located in the bonding region and spaced apart from an outer edge of the bonding region; and an electrostatic barrier line, the electrostatic barrier line has one end electrically connected with the bonding electrode, and the other end extends to the outer edge of the bonding region, and resistivity of the electrostatic barrier line is greater than resistivity of the bonding electrode.


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