The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Dec. 16, 2022
Applicants:
Pioneer Corporation, Tokyo, JP;
Tohoku Pioneer Corporation, Yamagata, JP;
Inventors:
Junji Taguchi, Yonezawa, JP;
Hiroki Tan, Yonezawa, JP;
Noriaki Waki, Yonezawa, JP;
Masaki Takahashi, Yonezawa, JP;
Assignees:
PIONEER CORPORATION, Tokyo, JP;
TOHOKU PIONEER CORPORATION, Yamagata, JP;
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/858 (2023.01); H05B 33/22 (2006.01); H05B 33/28 (2006.01); H10K 50/00 (2023.01); H10K 50/81 (2023.01); H10K 50/813 (2023.01); H10K 50/828 (2023.01); H10K 59/173 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01); H10K 102/10 (2023.01);
U.S. Cl.
CPC ...
H10K 50/858 (2023.02); H05B 33/22 (2013.01); H05B 33/28 (2013.01); H10K 50/00 (2023.02); H10K 50/81 (2023.02); H10K 50/813 (2023.02); H10K 50/828 (2023.02); H10K 59/173 (2023.02); H10K 77/10 (2023.02); H10K 2102/00 (2023.02); H10K 2102/103 (2023.02); H10K 2102/351 (2023.02);
Abstract
A light-emitting device includes a light-transmitting substrate, a light-transmitting interconnect located over the substrate, an insulating layer located over the substrate and the interconnect, and an intermediate layer formed in at least a region of a lateral side of the interconnect that overlaps the insulating layer.