The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Sep. 14, 2020
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Patrick Margavio, Columbia, MO (US);

Todd Brooke, Columbia, MO (US);

Kurt English, Columbia, MO (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/28 (2006.01); B23K 20/02 (2006.01); B23K 101/40 (2006.01); B23K 103/10 (2006.01); B23K 103/18 (2006.01); C04B 35/581 (2006.01); C04B 37/02 (2006.01); H01L 21/67 (2006.01); H05B 1/02 (2006.01); H05B 3/12 (2006.01);
U.S. Cl.
CPC ...
H05B 3/283 (2013.01); C04B 35/581 (2013.01); C04B 37/023 (2013.01); H05B 1/0233 (2013.01); H05B 3/12 (2013.01); B23K 20/02 (2013.01); B23K 2101/40 (2018.08); B23K 2103/10 (2018.08); B23K 2103/18 (2018.08); C04B 2237/122 (2013.01); C04B 2237/16 (2013.01); C04B 2237/366 (2013.01); C04B 2237/62 (2013.01); H01L 21/67103 (2013.01); H05B 2203/005 (2013.01); H05B 2203/016 (2013.01); H05B 2203/017 (2013.01);
Abstract

A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.


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