The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Jul. 14, 2021
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Jumpei Yoneyama, Nagano, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/55 (2023.01); A61B 1/00 (2006.01); G02B 23/24 (2006.01); H01L 27/146 (2006.01); H04N 23/50 (2023.01); H04N 23/54 (2023.01);
U.S. Cl.
CPC ...
H04N 23/55 (2023.01); G02B 23/2484 (2013.01); H01L 27/1462 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H04N 23/54 (2023.01); A61B 1/0011 (2013.01); H04N 23/555 (2023.01);
Abstract

A manufacturing method of an image pickup apparatus for endoscope includes manufacturing an optical member in which a plurality of optical devices are stacked, and an image pickup member including an image pickup device having a light receiving surface, measuring a position of an image-forming plane on which an object image, light of which is focused by the optical member, is formed, and fixing the optical member and the image pickup member in a state where an interval is adjusted so that a measured position of the image-forming plane becomes a position of the light receiving surface by performing curing processing on a transparent resin disposed to fill an optical path between the optical member and the image pickup member.


Find Patent Forward Citations

Loading…