The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Jun. 21, 2019
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Daisuke Chino, Kanagawa, JP;
Hiroyuki Shigeta, Kanagawa, JP;
Shigekazu Ishii, Kanagawa, JP;
Koyo Hosokawa, Kanagawa, JP;
Hirohisa Yasukawa, Kanagawa, JP;
Mitsuhito Kanatake, Kanagawa, JP;
Kosuke Hareyama, Kanagawa, JP;
Yutaka Ootaki, Kanagawa, JP;
Kiyohisa Sakai, Kanagawa, JP;
Atsushi Tsukada, Kanagawa, JP;
Hirotaka Kobayashi, Kanagawa, JP;
Ninao Sato, Kanagawa, JP;
Yuki Yamane, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.