The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Feb. 10, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Il Min Lee, Gwangmyeong-si, KR;

Hoon-Sung Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/84 (2006.01); H01L 29/10 (2006.01); H01L 29/786 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1203 (2013.01); H01L 21/84 (2013.01); H01L 29/1083 (2013.01); H01L 29/78648 (2013.01); H01L 23/535 (2013.01);
Abstract

A semiconductor device includes: a substrate; a first buried insulation layer disposed on the substrate; a first well which is disposed on the first buried insulation layer in a first region defined by a first element separation film, and includes a first portion extending along an upper surface of the first buried insulation layer, and a second portion extending from the first portion in a direction from the substrate toward the first buried insulation layer; a second buried insulation layer disposed on the first portion of the first well; a first semiconductor film disposed on the second buried insulation layer; a first transistor on the first semiconductor film; and a second element separation film which separates the second buried insulation layer and the first semiconductor film from the second portion of the first well, on the first portion of the first well, wherein an upper surface of the second portion of the first well is placed on the same plane as an upper surface of the first element separation film.


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