The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Jan. 28, 2021
Infineon Technologies Ag, Neubiberg, DE;
Frank Sauerland, Werne, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor arrangement includes a controllable semiconductor element having an active region, and bonding wires arranged in parallel to each other in a first horizontal direction. The active region has a first length in the first horizontal direction and a first width in a second horizontal direction perpendicular to the first horizontal direction. Each bonding wire is electrically and mechanically coupled to the controllable semiconductor element by a first number of bond connections arranged above the active region. A first bond connection of each bonding wire is arranged at a first distance from a first edge of the active region. A second bond connection of each bonding wire is arranged at a second distance from a second edge of the active region opposite the first edge. The first and second distances are both less than the first length divided by twice the first number of bond connections.