The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Oct. 21, 2021
Applicants:
Hefei Boe Display Technology Co., Ltd., Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Chunxu Zhang, Beijing, CN;
Xiaoting Jiang, Beijing, CN;
Min Cheng, Beijing, CN;
Maoxiu Zhou, Beijing, CN;
Haipeng Yang, Beijing, CN;
Ke Dai, Beijing, CN;
Assignees:
Hefei BOE Display Technology Co., Ltd., Anhui, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 24/05 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05179 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05563 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06517 (2013.01);
Abstract
Provided is an array substrate. The array substrate includes at least one pad group disposed in a peripheral region of a base substrate, wherein the at least one pad group includes a sector pad group in which the pads are distributed in a sector shape. Therefore, the bonding yield between the array substrate and the circuit board is increased.