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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11942431 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

Jul. 27, 2022

Semiconductor device and manufacturing method thereof

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Nobuyuki Momo, Yokkaichi Mie, JP;

Keisuke Nakatsuka, Kobe Hyogo, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Joseph C Nicely

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/482 (2006.01); H01L 23/522 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 27/07 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/4821 (2013.01); H01L 23/5223 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/0733 (2013.01); H01L 27/0805 (2013.01); H01L 28/40 (2013.01); H01L 28/60 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/8034 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/19041 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a first semiconductor chip including a first metal pad and a second metal pad; and a second semiconductor chip including a third metal pad and a fourth metal pad, the third metal pad joined to the first metal pad, the fourth metal pad coupled to the second metal pad via a dielectric layer, wherein the second semiconductor chip is coupled to the first semiconductor chip via the first metal pad and the third metal pad.

Find Patent Forward Citations

Momo, Nobuyuki. (2024). Semiconductor device and manufacturing method thereof (U.S. Patent No. 11942431). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11942431

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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