The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Apr. 07, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ilyoung Han, Uiwang-si, KR;
Mingi Hong, Hwaseong-si, KR;
Choongbo Shim, Asan-si, KR;
Heejin Kim, Cheonan-si, KR;
Nungpyo Hong, Goyang-si, KR;
Abstract
In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.