The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Feb. 05, 2021
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Daizo Ito, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H01C 7/00 (2006.01); H01C 17/28 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); H10N 30/067 (2023.01); H10N 30/088 (2023.01); H10N 30/50 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01C 7/008 (2013.01); H01C 17/28 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H10N 30/067 (2023.02); H10N 30/088 (2023.02); H10N 30/50 (2023.02); H10N 30/87 (2023.02);
Abstract
Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.