The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Nov. 04, 2019
Applicant:

Silergy Semiconductor Technology (Hangzhou) Ltd, Hangzhou, CN;

Inventors:

Jian Wei, Hangzhou, CN;

Ke Dai, Hangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/02 (2006.01); H01F 27/24 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 27/022 (2013.01); H01F 27/24 (2013.01); H01L 25/16 (2013.01); H01L 28/10 (2013.01);
Abstract

A package device can include: a package body having a support body and an encapsulating body configured to encapsulate a conductive body of the package device; at least one extraction electrode electrically connected to the conductive body, and having a part exposed outside the package body; and where the support body is located on only part of a bottom surface of the encapsulating body, and protrudes from the bottom surface of the encapsulating body to form a cavity defined by the remaining exposed bottom surface of the encapsulating body and inner side surface of the supporting body.


Find Patent Forward Citations

Wei, Jian. (2024). Supportable package device and package assembly (U.S. Patent No. 11942263). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11942263

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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