The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11941568 B1

Date of Patent:

Mar. 26, 2024

Filed:

Feb. 24, 2022

Method for quality monitoring of additive manufacturing processes

Applicant:

Fabrisonic Llc, Columbus, OH (US);

Inventors:

Mark I. Norfolk, Powell, OH (US);

Adam J. Hehr, Columbus, OH (US);

Assignee:

Attorney:

Primary Examiner:

Leo B Tentoni

Int. Cl.

CPC ...

B22F 10/30 (2021.01); B22F 10/80 (2021.01); B22F 10/85 (2021.01); B22F 12/90 (2021.01); B23K 20/10 (2006.01); B29C 33/72 (2006.01); B29C 64/147 (2017.01); B29C 64/194 (2017.01); B29C 64/245 (2017.01); B29C 64/35 (2017.01); B29C 64/386 (2017.01); B29C 64/393 (2017.01); B29C 65/08 (2006.01); B33Y 50/02 (2015.01); G01B 11/16 (2006.01); G01K 7/04 (2006.01); G01L 1/22 (2006.01); G01P 15/00 (2006.01); G05B 19/4099 (2006.01); G06F 11/30 (2006.01); G06Q 10/0639 (2023.01); G06Q 50/04 (2012.01); B22F 5/00 (2006.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 12/30 (2021.01); B29C 33/38 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/00 (2015.01); B33Y 80/00 (2015.01);

U.S. Cl.

CPC ...

G06Q 10/06395 (2013.01); B22F 10/85 (2021.01); B22F 12/90 (2021.01); B29C 64/194 (2017.08); G06F 11/3089 (2013.01); G06Q 50/04 (2013.01); B22F 5/007 (2013.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 12/30 (2021.01); B29C 33/3842 (2013.01); B29C 2033/385 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); B33Y 80/00 (2014.12); G05B 2219/49015 (2013.01);

Abstract

A method for quality control monitoring of additive manufacturing processes comprising forming at least one channel in an additive manufacturing build platform, wherein the channel is formed in the upper surface of the build platform to a predetermined depth, and wherein the channel is formed in a predetermined pattern across the upper surface of the build platform; placing a sensor in the channel formed in the upper surface of the build platform, wherein the sensor gathers information relevant to an additive manufacturing process occurring on or in close proximity to the build platform; enclosing the sensor within the channel formed in the upper surface of the build platform with an additive manufacturing substrate, wherein components or parts are built directly on the substrate using an additive manufacturing process, and using the sensor to gather information about the components or parts and the additive manufacturing process itself.

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