The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Jul. 20, 2020
Sony Group Corporation, Tokyo, JP;
Aki Nakano, Tokyo, JP;
SONY GROUP CORPORATION, Tokyo, JP;
Abstract
A contactless communication medium according to an embodiment of the present technology includes an IC module, a first member, a second member, and a print layer. The IC module is capable of performing a contactless communication. The first member is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface. The second member is made of a second transparent resin material, the second member being connected to the first surface or the second surface. The print layer is arranged between the first member and the second member.