The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Dec. 14, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Mu-Tien Chang, Santa Clara, CA (US);
Krishna T. Malladi, San Jose, CA (US);
Dimin Niu, Sunnyvale, CA (US);
Hongzhong Zheng, Los Gatos, CA (US);
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/0875 (2016.01); G06F 13/12 (2006.01); G06F 13/16 (2006.01); G06F 9/30 (2018.01);
U.S. Cl.
CPC ...
G06F 12/0875 (2013.01); G06F 13/124 (2013.01); G06F 13/1636 (2013.01); G06F 13/1689 (2013.01); G06F 9/3001 (2013.01); G06F 9/30098 (2013.01); G06F 2212/452 (2013.01);
Abstract
A method of processing in-memory commands in a high-bandwidth memory (HBM) system includes sending a function-in-HBM instruction to the HBM by a HBM memory controller of a GPU. A logic component of the HBM receives the FIM instruction and coordinates the instructions execution using the controller, an ALU, and a SRAM located on the logic component.