The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Nov. 17, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

David J. Lewison, LaGrangeville, NY (US);

Jay A. Bunt, Esopus, NY (US);

Frank L. Pompeo, Redding, CT (US);

Richard Walter Oldrey, Clintondale, NY (US);

John D. Sylvestri, Poughkeepsie, NY (US);

Phong T. Tran, Highland, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/20 (2006.01); G01B 5/06 (2006.01); G01B 5/30 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G01B 5/20 (2013.01); G01B 5/06 (2013.01); G01B 5/30 (2013.01); H01L 21/67253 (2013.01);
Abstract

A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.


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