The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Sep. 21, 2021
The Aerospace Corporation, El Segundo, CA (US);
Geena L. Ferrelli, Marina Del Rey, CA (US);
Hyun I. Kim, Brea, CA (US);
Rafael J. Zaldivar, Redondo Beach, CA (US);
THE AEROSPACE CORPORATION, El Segundo, CA (US);
Abstract
Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state. Additionally, testing occurs within hours versus months, enabling short lead times for root-cause investigations.