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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11939500 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

Sep. 28, 2021

Diecut especially for permanently closing holes

Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Katja Meyer, Hamburg, DE;

Tim Baumann, Hamburg, DE;

Christoph Nagel, Hamburg, DE;

Assignee:

tesa SE, Norderstedt, DE;

Attorney:

Norris McLaughlin, P.A.

Primary Examiner:

Michael Zhang

Int. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 7/12 (2013.01); B32B 9/04 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C09J 7/385 (2018.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/718 (2013.01); B32B 2307/732 (2013.01);
Abstract

Diecuts and methods for closing of holes in metal sheets or in plastics parts are disclosed. The diecuts have a carrier composed of an assembly that comprises a metallic first layer having a thickness of 10 to 40 μm, a second layer of a woven or laid glass fabric having a basis weight of 30 to 200 g/m, an optional first adhesive third layer, an unexpanded expandable graphite fourth layer having a thickness of at least 0.2 to 3.0 mm, and a second adhesive fifth layer. The expandable graphite being present in the fourth layer to an extent of at least 80 wt % and fifth layer being formed by an adhesive having a basis weight of 300 to 1800 g/mand/or a thickness of 400 to 1800 μm.

Find Patent Forward Citations

Meyer, Katja. (2024). Diecut especially for permanently closing holes (U.S. Patent No. 11939500). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11939500

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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