logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11939466 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

Sep. 13, 2019

Thermoplastic polyester resin composition and molded article

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Kohei Miyamoto, Nagoya, JP;

Yusuke Tojo, Nagoya, JP;

Makito Yokoe, Nagoya, JP;

Kosuke Shirotani, Nagoya, JP;

Yasuo Maeda, Nagoya, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
C08L 67/02 (2006.01); B32B 15/085 (2006.01); B32B 15/09 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); C08K 5/50 (2006.01); C08L 23/06 (2006.01); C08L 23/08 (2006.01); C08L 25/06 (2006.01); C08L 25/08 (2006.01); C08L 67/00 (2006.01); C08L 71/12 (2006.01); C08L 81/04 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08L 67/02 (2013.01); B32B 15/09 (2013.01); B32B 27/20 (2013.01); B32B 27/36 (2013.01); B32B 15/085 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 2270/00 (2013.01); B32B 2307/204 (2013.01); B32B 2457/00 (2013.01); C08K 5/50 (2013.01); C08L 23/06 (2013.01); C08L 23/08 (2013.01); C08L 23/0884 (2013.01); C08L 25/06 (2013.01); C08L 25/08 (2013.01); C08L 67/00 (2013.01); C08L 71/12 (2013.01); C08L 81/04 (2013.01);
Abstract

Provided is a thermoplastic polyester resin composition comprising 100 parts by weight of (A) a non-liquid crystal thermoplastic polyester resin, 45 to 150 parts by weight of (B) a thermoplastic resin that is different from the non-liquid crystal thermoplastic polyester resin and has a dielectric loss tangent of not more than 0.005 when measured at a frequency of 5.8 GHz by the cavity resonance perturbation method, 2 to 20 parts by weight of (C) a compatibilizer having at least one reactive functional group selected from epoxy, acid anhydride, oxazoline, isocyanate, and carbodiimide groups, and 0.2 to 5 parts by weight of (D) at least one compound selected from tertiary amines, amidine compounds, organic phosphines and salts thereof, imidazoles, and boron compounds, wherein the ratio of the sum of the thermoplastic resin (B) and the compatibilizer (C) is in the range of 50 to 150 parts by weight and the weight ratio (B)/(C) of the thermoplastic resin (B) to the compatibilizer (C) is in the range of 8 to 50. The thermoplastic polyester resin composition can be molded into an article with low dielectric properties, excellent mechanical properties, and high bondability to metals.

Find Patent Forward Citations

Loading…