The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Nov. 29, 2021
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Junseok Lee, Seoul, KR;

Dongjoo You, Seoul, KR;

Seongmoon Cho, Seoul, KR;

Jinkyun Lee, Seoul, KR;

Seungsoo Choi, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 7/26 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 7/26 (2013.01); C08J 2327/18 (2013.01); C08J 2379/08 (2013.01); C08K 2201/002 (2013.01);
Abstract

The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.


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