The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Sep. 13, 2018
Applicant:

Arkema France, Colombes, FR;

Inventors:

Guillaume Le, Herouville Saint Clair, FR;

Fabien Sguerra, Saint Laurent du Var, FR;

Assignee:

ARKEMA FRANCE, Colombes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/10 (2006.01); B29B 11/16 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); B29K 71/00 (2006.01); B29K 105/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/10 (2013.01); B29B 11/16 (2013.01); C08J 5/042 (2013.01); C08J 5/243 (2021.05); C08J 5/249 (2021.05); B29K 2071/00 (2013.01); B29K 2105/0005 (2013.01); B29K 2105/0094 (2013.01); B29K 2307/04 (2013.01); C08J 2371/00 (2013.01);
Abstract

A process for preparing a semifinished product comprising a PAEK-based resin and reinforcing fibers, including: preparing a dispersion comprising a PAEK-based resin in pulverulent form dispersed in an aqueous phase including at least one volatile organic compound and optionally a surfactant; bringing the reinforcing fibers into contact with said aqueous dispersion; drying the fibers impregnated with dispersion; and heating the impregnated fibers to a temperature sufficient for the melting of the resin, so as to form a semifinished product, wherein the aqueous phase of the dispersion has a dynamic viscosity, measured at 25° C. under a shear stress of 6.8 son a Brookfield DV2T Extra viscometer, is between 0.1 and 25 Pa·s; and wherein when the surfactant is present, its content is less than 1% by weight relative to the mass of dispersed resin.


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