The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
May. 15, 2019
Dow Global Technologies Llc, Midland, MI (US);
Luis Alberto Santini, Tarragona, ES;
Radisa Boskovic, Horgen, CH;
Peter Hermann Roland Sandkuehler, Horgen, CH;
Ramon Pradas Cortina, Barcelona, ES;
Marti Nogué I Arbusa, Barcelona, ES;
Carlos Almor Morujo, Barcelona, ES;
Dow Global Technologies LLC, Midland, MI (US);
Abstract
The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries of sealant layers and form a partially sealed package having an opening; inserting the heated spout into the opening; and pressing opposing surfaces of the two multilayer structures around the spout to close the opening around the spout. Each multilayer structure includes a multilayer film having the sealant layer having at least 40% by weight of an ethylene-based polymer having a melting point below 112 C; an external layer including an ethylene-based polymer; and at least one intermediate layer disposed between the sealant layer and the external layer having a melting point at least 15 C higher than the sealant layer.