The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Sep. 30, 2020
Applicant:

Huazhong University of Science and Technology, Hubei, CN;

Inventors:

Bin Su, Hubei, CN;

Hongzhi Wu, Hubei, CN;

Chunze Yan, Hubei, CN;

Yusheng Shi, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/386 (2017.01); B22F 10/18 (2021.01); B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 12/30 (2021.01); B29C 64/153 (2017.01); B29C 64/307 (2017.01); B33Y 80/00 (2015.01); H10N 30/30 (2023.01); H10N 30/80 (2023.01); H10N 35/80 (2023.01); B22F 10/12 (2021.01);
U.S. Cl.
CPC ...
B29C 64/386 (2017.08); B22F 10/18 (2021.01); B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 12/30 (2021.01); B29C 64/153 (2017.08); B29C 64/307 (2017.08); B33Y 80/00 (2014.12); H10N 30/302 (2023.02); H10N 30/80 (2023.02); H10N 35/80 (2023.02); B22F 10/12 (2021.01); Y10T 29/42 (2015.01);
Abstract

The disclosure belongs to the technical field of additive manufacturing, and discloses a flexible piezoelectric sensor based on 4D printing and a preparation method thereof. The sensor includes a magnetic part and a conductive part, wherein: the conductive part includes two substrates disposed opposite to each other and a spiral structure disposed between the two substrates. Both the two substrates and the spiral structure are made of conductive metal materials. The magnetic part has a flexible porous structure and is arranged between the two substrates to generate a magnetic field. When the substrate is subjected to external pressure, the spiral structure and the magnetic part are compressed simultaneously, the magnetic flux passing through the spiral structure changes, and the voltage of the two substrates changes, by measuring the voltage change of the two substrates to reflect the change of external pressure, the pressure measuring process is achieved.


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