The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Aug. 15, 2019
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Nobuki Hirooka, Yokohama, JP;
Masao Yamawaki, Kure, JP;
Assignee:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B29C 64/118 (2017.01); B29C 64/209 (2017.01); B29C 64/35 (2017.01); B29C 70/20 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
B29C 64/209 (2017.08); B29C 64/118 (2017.08); B29C 64/35 (2017.08); B29C 70/20 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract
Provided is a molding technique with which a molding operation is performed smoothly, preventing the production of defective products. Also provided is a molding apparatus including a nozzle, a guide member guiding a molding material to the nozzle, and a heating device, the molding apparatus being further provided with a prevention structure configured to prevent the molding material from melting during transportation through the guide member.