The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Jun. 09, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Danielle DeGraw, Pleasant Valley, NY (US);
Yat-Kiu-Kent Fung, Woodside, NY (US);
James Robert Rozen, Peekskill, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/06 (2006.01); B23K 1/00 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 5/12 (2006.01); C25D 5/34 (2006.01); C25D 5/38 (2006.01); C25D 7/06 (2006.01); H01B 11/18 (2006.01); H01B 12/00 (2006.01); H01P 11/00 (2006.01); B23K 101/38 (2006.01); H01B 13/016 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/0008 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 5/38 (2013.01); C25D 7/0607 (2013.01); H01B 11/1817 (2013.01); H01B 12/00 (2013.01); H01P 3/06 (2013.01); H01P 11/005 (2013.01); B23K 2101/38 (2018.08); H01B 13/016 (2013.01);
Abstract
A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.