The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Apr. 09, 2021
Applicant:

Esaote S.p.a., Genoa, IT;

Inventors:

Francesco Bertocci, Santa Maria a Monte, IT;

Ramona De Luca, Florence, IT;

Assignee:

Esaote S.p.A., Genoa, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); A61B 8/00 (2006.01); G10K 11/32 (2006.01); H04R 17/00 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0622 (2013.01); G10K 11/32 (2013.01); H04R 17/005 (2013.01); A61B 8/4494 (2013.01);
Abstract

Transducer assembly transmits ultrasonic energy towards a zone acoustically coupled to an object or area of interest, and comprises a piezoelectric subassembly matching a curved support layer disposed behind said subassembly. Piezoelectric subassembly comprises piezoelectric elements and metal connections. Piezoelectric elements are disposed along a first azimuth direction to form parallel curved segments of piezoelectric elements extending in a second elevation direction, each being in contact with a corresponding metal connection extending in the elevation direction for transmitting/receiving electric signals to/from each piezoelectric segment. The subassembly has a a central part comprising piezoelectric material and a lateral part comprising resin material incorporating the metal connections so that each curved segment results in a sequence of resin/piezoelectric/resin materials disposed along the elevation direction with the extension and curvature of the piezoelectric material in the central part defining the elevation focussing of the transducer assembly. A corresponding manufacturing process is also disclosed.


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