The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Jul. 06, 2020
Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventors:

John Burns, IV, Cambridge, MA (US);

Julianne Grainger, Boston, MA (US);

Bryan McLaughlin, Cambridge, MA (US);

Tirunelveli S. Sriram, Acton, MA (US);

John Lachapelle, Princeton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61B 5/00 (2006.01); A61N 1/02 (2006.01); A61N 1/04 (2006.01); A61N 1/36 (2006.01); A61B 5/24 (2021.01); A61B 18/00 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0551 (2013.01); A61B 5/4041 (2013.01); A61B 5/4893 (2013.01); A61B 5/6877 (2013.01); A61N 1/02 (2013.01); A61N 1/048 (2013.01); A61N 1/05 (2013.01); A61N 1/0529 (2013.01); A61N 1/0534 (2013.01); A61N 1/0539 (2013.01); A61N 1/36185 (2013.01); A61B 5/24 (2021.01); A61B 2018/00434 (2013.01); A61B 2562/125 (2013.01); A61N 1/0492 (2013.01);
Abstract

The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.


Find Patent Forward Citations

Loading…