The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Mar. 10, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Chan Jin Park, Suwon-si, KR;
Hyun Seok Yang, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); C25D 7/00 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/064 (2013.01); C25D 3/38 (2013.01); C25D 5/022 (2013.01); C25D 5/48 (2013.01); C25D 7/00 (2013.01); G03F 7/0035 (2013.01); G03F 7/164 (2013.01); H05K 3/062 (2013.01);
Abstract
A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.