The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Mar. 10, 2020
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Shingo Hayashi, Kyoto, JP;

Daisuke Konishi, Kyoto, JP;

Assignee:

OMRON CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/695 (2023.01); G01B 11/06 (2006.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
H04N 23/695 (2023.01); G01B 11/0608 (2013.01); G01N 21/956 (2013.01); G01N 2021/95646 (2013.01); G01N 2201/1042 (2013.01);
Abstract

Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit (); a height measurement unit (); a moving mechanism () that moves the imaging unit () and the height measurement unit (). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit (), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit ().


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