The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Mar. 20, 2019
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventors:

Rob Salmond, Nepean, CA;

Carl Conradi, Ottawa, CA;

Somsack Sychaleun, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/07 (2006.01); H01L 23/66 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H03F 3/211 (2013.01); H01L 23/66 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6672 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21106 (2013.01);
Abstract

A transistor package for a power amplifier is provided. The transistor package includes a plurality of radio frequency, RF, paths that includes a first RF path and second RF path. Each RF path includes a transistor-carrying die and at least one impedance element. The transistor package includes a circuit portion electrically coupling a first impedance element in the first RF path to a second impedance element in the second RF path where the circuit portion includes at least one resistor.


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