The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
May. 06, 2021
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Marvin Marbell, Morgan Hill, CA (US);
Jonathan Chang, Morgan Hill, CA (US);
Haedong Jang, San Jose, CA (US);
Qianli Mu, San Jose, CA (US);
Michael LeFevre, Morgan Hill, CA (US);
Jeremy Fisher, Raleigh, NC (US);
Basim Noori, San Jose, CA (US);
Assignee:
MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC., Lowell, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H03F 1/565 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01);
Abstract
A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.