The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Mar. 07, 2022
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Koichi Masuda, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/487 (2007.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H02M 7/487 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01);
Abstract
An object is to provide a technique capable of improving the power efficiency of a semiconductor device. The semiconductor device includes first to sixth parallel connection bodies, each including a semiconductor switching element and a diode connected in antiparallel to the semiconductor switching element. At least one of the voltage drops of the second parallel connection body and the third parallel connection body is smaller than a voltage drop of at least one of the first parallel connection body, the fourth parallel connection body, the fifth parallel connection body, and the sixth parallel connection body.