The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Aug. 28, 2020
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Abdelkrim El Amili, La Jolla, CA (US);

Yeshaiahu Fainman, La Jolla, CA (US);

Cheng-Yi Fang, La Jolla, CA (US);

Hung-Hsi Lin, La Jolla, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/15 (2006.01); G02F 1/01 (2006.01); G02F 1/03 (2006.01); G02F 1/21 (2006.01); H01P 3/00 (2006.01); H01P 3/16 (2006.01); H01P 5/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/15 (2013.01); G02F 1/011 (2013.01); G02F 1/0338 (2013.01); G02F 1/21 (2013.01); H01P 3/00 (2013.01); H01P 3/003 (2013.01); H01P 3/16 (2013.01); H01P 5/00 (2013.01); G02F 1/212 (2021.01); G02F 2201/16 (2013.01); G02F 2203/055 (2013.01);
Abstract

Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.


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