The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

May. 24, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Mihye Jang, Hwaseong-si, KR;

Seungjoo Nah, Gwangju, KR;

Minho Jang, Suwon-si, KR;

Heegeun Jeong, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H10K 39/32 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 21/76898 (2013.01); H01L 24/83 (2013.01); H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); H10K 39/32 (2023.02); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/83931 (2013.01); H01L 2224/83951 (2013.01);
Abstract

An image sensor includes a first structure including a first substrate, and a first internal wiring structure on the first substrate. The first substrate includes an active pixel region and a through electrode region around the active pixel region. The first internal wiring structure includes a plurality of first internal wiring patterns. The image sensor further includes a second structure including a second substrate and a second internal wiring structure on the second substrate. The second substrate is arranged on the first substrate. The image sensor additionally includes a through electrode layer arranged in the through electrode region to at least partially fill a through electrode trench, which penetrates the first substrate, and to connect the first internal wiring structure to the second internal wiring structure.


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