The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Nov. 20, 2020
Sansha Electric Manufacturing Co., Ltd., Osaka, JP;
Tomohiro Yamanaka, Osaka, JP;
Yoichi Makimoto, Osaka, JP;
SANSHA ELECTRIC MANUFACTURING CO., LTD., Osaka, JP;
Abstract
An object is to suppress a lift of an external terminal when an external force is applied, thereby improving the reliability of a semiconductor device. A heat radiating platehaving on one main surface a circuit areain which a semiconductor elementis arranged, a pair of terminalsandconnected to the semiconductor element, a resin housingthat covers the circuit areaof the heat radiating plateto seal the semiconductor element, and has a terminal surfaceformed on an upper surface, a pair of side surfaces in the longitudinal direction, and a pair of front and rear surfaces in the lateral direction, are included. The resin housinghas a pair of bending contact portionsandthat come into respectively contact with the pair of terminalsandto define bending positions of the terminalsand. The pair of bending contact portionsandare formed to have different heights. The pair of terminalsandprotrude from the resin housingat positions sandwiching the nut accommodating opening, and are bent so as to overlap each other on the nut accommodating opening