The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Dec. 06, 2021
Applicant:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Inventors:
Assignee:
HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 24/40 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/09701 (2013.01);
Abstract
A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.