The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Apr. 24, 2018
Disco Hi-tec Europe Gmbh, Kirchheim b. Muenchen, DE;
Takatori Corporation, Kashihara, JP;
Karl Heinz Priewasser, Kirchheim b. Muenchen, DE;
Ken Ikehata, Kashihara, JP;
Yoshinori Kakinuma, Kashihara, JP;
Yosuke Ishimatsu, Kashihara, JP;
DISCO HI-TEC EUROPE GMBH, Kirchheim b. Muenchen, DE;
TAKATORI CORPORATION, Kashihara, JP;
Abstract
To satisfactorily apply a protective tape to a bump wafer, an application apparatus () for applying a protective tape (PT) to a wafer (W) includes: an application table () configured to support the wafer (W); a tape holding body () capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body () onto the wafer (W); and a pressing member () configured to press the protective tape (PT) from above. The pressing member () includes a protective layer outer periphery retainer () configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).