The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Jul. 30, 2019
Applicant:

Endress+hauser Flowtec Ag, Reinach, CH;

Inventors:

Benjamin Schwenter, Breitenbach, CH;

Marc Werner, Grenzach-Wyhlen, DE;

Claude Hollinger, Aesch, CH;

Martin Stucki, Pratteln, CH;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 9/00 (2006.01); G01F 1/84 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
G01N 9/002 (2013.01); G01F 1/8422 (2013.01); G01F 1/8427 (2013.01); G01F 1/8431 (2013.01); G01F 1/8477 (2013.01); H01F 27/2804 (2013.01); G01N 2009/006 (2013.01); H01F 2027/2809 (2013.01);
Abstract

The present disclosure relates to a measuring transducer of a measurement device for registering a mass flow or a density of a medium The measuring transducer includes a measuring tube, at least one exciter adapted to excite the measuring tube to execute oscillations, and two sensors adapted to register deflection of oscillations of the measuring tube. The exciter and the sensors each have a coil device including a circuit board with a first coefficient of thermal expansion. The coil device of the sensors or exciter are/is secured using a holder apparatus adapted to clamp the circuit board, wherein the circuit board is mechanically contacted by the holder apparatus using at least one holder element, wherein the holder element has a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion and the second coefficient of thermal expansion differ from one another by less than 3*10/Kelvin.


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