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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11932782 B1

PDFFull Text
Date of Patent:
Mar. 19, 2024

Filed:

Aug. 20, 2020

Room temperature curable resin composition, coating agent, adhesive, sealing agent, and article

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Taiki Katayama, Annaka, JP;

Tetsuro Yamada, Annaka, JP;

Munenao Hirokami, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C09D 7/63 (2018.01); C08K 5/544 (2006.01); C08L 83/08 (2006.01); C08L 101/10 (2006.01); C09D 7/48 (2018.01); C09D 7/65 (2018.01); C09D 183/08 (2006.01); C09D 201/10 (2006.01);
U.S. Cl.
CPC ...
C09D 7/63 (2018.01); C08K 5/544 (2013.01); C08L 83/08 (2013.01); C08L 101/10 (2013.01); C09D 7/48 (2018.01); C09D 7/65 (2018.01); C09D 183/08 (2013.01); C09D 201/10 (2013.01);
Abstract

The present invention is a room temperature curable resin composition comprising: as the main agent, an organic polymer in which both molecular chain terminals are sealed by a silanol group and/or a hydrolyzable silyl group; and an organic silicon compound of a specific structure having, in a molecule, an organosiloxane structure, a hydrolyzable silyl group, and a hindered amine skeleton. This resin composition produces a cured product in which the degradation over time associated with the effects of light such as UV rays can be suppressed.

Find Patent Forward Citations

Katayama, Taiki. (2024). Room temperature curable resin composition, coating agent, adhesive, sealing agent, and article (U.S. Patent No. 11932782). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11932782

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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