The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Feb. 12, 2020
Applicant:
Unitika Ltd., Amagasaki, JP;
Inventors:
Toshiki Nagahata, Uji, JP;
Takatoshi Murakami, Uji, JP;
Assignee:
UNITIKA LTD., Amagasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 69/00 (2006.01); C08K 5/524 (2006.01); C08K 5/526 (2006.01); C08K 5/5393 (2006.01); C08K 5/5397 (2006.01); C08K 5/5419 (2006.01); C08L 67/03 (2006.01);
U.S. Cl.
CPC ...
C08L 67/03 (2013.01); C08K 5/524 (2013.01); C08K 5/526 (2013.01); C08K 5/5393 (2013.01); C08K 5/5397 (2013.01); C08K 5/5419 (2013.01); C08L 69/00 (2013.01); C08L 2201/08 (2013.01); C08L 2201/10 (2013.01); C08L 2203/20 (2013.01);
Abstract
The present invention provides a polyarylate resin composition sufficiently excellent in heat resistance, transparency, heat discoloration resistance and moist heat resistance, and a molded article made of the same. The present invention relates to a polyarylate resin composition containing 0.005˜5 parts by mass of a silane compound (C) with a boiling point of 200° C. or more, based on 100 parts by mass of the total of a polyarylate resin (A) and a polycarbonate resin (B), a content ratio of the polyarylate resin (A) and the polycarbonate resin (B) being 5/95 to 95/5 (mass ratio).