The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Feb. 05, 2021
Applicant:
Asahi Kasei Construction Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
Asahi Kasei Construction Materials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 8/10 (2006.01); B32B 5/02 (2006.01); B32B 5/20 (2006.01); B32B 5/24 (2006.01); B32B 29/00 (2006.01); C08J 9/14 (2006.01);
U.S. Cl.
CPC ...
C08G 8/10 (2013.01); B32B 5/022 (2013.01); B32B 5/20 (2013.01); B32B 5/245 (2013.01); B32B 29/007 (2013.01); C08J 9/141 (2013.01); B32B 2266/0285 (2013.01); B32B 2266/08 (2013.01); B32B 2307/304 (2013.01); B32B 2307/72 (2013.01); B32B 2307/748 (2013.01); C08J 2361/10 (2013.01);
Abstract
Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/mand not more than 55 kg/m, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10min the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.