The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Feb. 04, 2022
Applicant:
SK Enpulse Co., Ltd., Gyeonggi-do, KR;
Inventors:
Assignee:
SK ENPULSE CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B24B 37/24 (2012.01); B24B 37/26 (2012.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/26 (2013.01); B24D 11/00 (2013.01); B24D 11/003 (2013.01); H01L 21/3212 (2013.01);
Abstract
Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, a process for preparing the same, and a process for preparing a semiconductor device using the same. In the polishing pad according to the embodiment, the size (or diameter) and distribution of a plurality of pores are adjusted, whereby the polishing performance such as polishing rate and within-wafer non-uniformity can be further enhanced.