The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Jan. 29, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Michael Gabriel Monroe, Corvallis, OR (US);
Pedro Ros Zuazua, Sant Cugat del Valles, ES;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/50 (2021.01); B22F 10/14 (2021.01); B22F 10/38 (2021.01); B22F 12/30 (2021.01); B22F 12/63 (2021.01); B29C 64/165 (2017.01); B29C 64/245 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/32 (2021.01); B22F 10/322 (2021.01); B22F 12/70 (2021.01);
U.S. Cl.
CPC ...
B22F 10/50 (2021.01); B22F 10/14 (2021.01); B22F 10/38 (2021.01); B22F 12/30 (2021.01); B22F 12/63 (2021.01); B29C 64/165 (2017.08); B29C 64/245 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/32 (2021.01); B22F 10/322 (2021.01); B22F 12/70 (2021.01);
Abstract
In one example, a memory having instructions thereon that when executed cause a 3D printing system to repeatedly form each of multiple successive layers of powdered build material on a platform and apply a functional agent to build material in each layer, create a pressure difference across a thickness of build material on the platform, and increase the pressure difference over an extent of build material on the platform as the build material on the platform gets thicker.